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@font-face {
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<p>Open compute module  - OpenRMC-DM Subproject: Han Wang (Meta) - Hardware Fault Mgmt Subproject: Rama Bhimanadhuni (Microsoft), &amp; Yogesh Varma (Intel) - Fleet Memory Fault Mgmt Workstream Wiki: Drew Walton (Google) &amp; Yogesh Varma (Intel) - Profile Workstream Wiki: John Leung (Intel) Open Compute Project - Dual M.  The Open Compute Project is a vibrant Community that spans the data center IT infrastructure worldwide.  Scope This document defines the technical specifications for an Open Rack V3 Power Management Controller used in the Open Compute Project.  Mar 12, 2019 · The Open Compute Project community offers a complete portfolio of products to meet the needs of every facility, workload, and business model including 19&rdquo; rackmount equipment, 19&rdquo; compatible Project Olympus solutions, and the 21&rdquo; OpenRACK solutions.  &ldquo;blocks&rdquo; used for workloads like artificial intelligence and edge deployments. 0 Compliance Test Plans with over 200 total compliance tests. 1 Openness The Yosemite 3.  Let me explain.  UQD is an Intel initiative for open standard spill-free quick couplings for liquid cooling in data centers. 5.  When weighing the pros and cons of a Li-ion BBU for edge and micro-datacenter applications, remember this: Higher cap ex (capital expenditure), but significantly lower op ex (operational expenditure).  On one end, in has communication with the PSU or BBUs &ndash; through sliver straddle connector. &rdquo; I read this quote by Jim Rohn years ago and it really rings true these days.  DC-SCM 2.  The module is specified by its connector pin-out; The module may have one or more form-factors Open Compute Project &ndash; Dual M.  License .  Many thanks to all the nominees and also to those who are passing the baton to the new leads.  They are no longer an idea or a conceptual design, but are used in a variety of high value products, such as CPUs, and GPUs for datacenter and AI applications or for Sep 3, 2024 · Open Compute Accelerates the Ecosystem Development of Compute Infrastructure in the Intelligent: 403 - TALK 2: Recording: P4OVN Offloading OVN Pipeline to Intel IPU: 403 - TALK 3: Recording: Open-Source Chips Achievements and Challenges: 403 - TALK 4: Recording: OCP solution for Korean datacenter: 403 - TALK 5: Recording: Data Center Liquid Feb 23, 2022 · Figure 1 OAI as a disaggregated compute for AI in a Rack.  Grossner leads its market intelligence function and is responsible for driving new innovation programs including guiding inventors developing their early-stage company ideas, setting strategic direction and building awareness of OCP, establishing new alliances, and launching new activities in OCP&rsquo;s Delta 5.  Serving as a cornerstone in OCP's strategy to penetrate emerging markets, OCP Experience Centers complement the OCP Ready&trade;, Product Recognition and OCP S.  Hardware Management Module; Hardware Fault Management; Cloud Service Model Workstream; The Open Compute Project was first initiated by Facebook, now Meta, in 2011.  In 2012, while at Dell Technologies developing custom solutions for hyperscale clients, he was introduced to the Open Compute Project. 0 specification.  OCP S.  Efficiency 9 2.  Pick a project and join us.  [1][2] Founded in 2011, OCP has significantly influenced the design and operation of large-scale computing facilities worldwide.  All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance to OCP's Bylaws and IP Aug 7, 2013 · Using Open Compute Project power supplies, the power shelf is 95% efficient.  Danfoss UQDB offers a self-alignment feature to help connect in location with limited access or visibility and guarantees 100% helium-leak testing Open Compute Project. 2 Accelerator Module Hardware Specification 2 August 18, 2020 Facebook OCP Contribution 1.  We invite open contributions in the following areas: The OpenRMC-DM Sub-Project is under the direction of the OCP Hardware Management Project Group.  Groups.  As many of you learned about the OCP Device Manager functionality during OCP TECH WEEK, the following will provide a summary of the technical aspects of Device Management, from a high level perspective. 0 Authors: Intel: Kasper Wszolek, Yi Zeng, Qian Wang, Katarzyna Krzewska Open Compute Project &ndash; M-XIO Base Specification, v1.  Sep 25, 2019 · The OCP Accelerator Mezzanine Module design specification, announced at the March 2019 Global OCP Summit, defines the form factor and common specifications for a compute accelerator module, a compliant base board design enabling interoperability across multiple ASIC or GPU based mezzanine modules, and a based board design plan.  %PDF-1.  As the 2024 OCP Global Summit approaches, the Market Impact and Supply Chain track is set to be one of the most engaging and insightful, highlighting how Open Compute Project (OCP) initiatives continue to shape the tech landscape. 4.  Khan emphasizes the need for collective effort and collaboration to address these RISC-V (pronounced &quot;risk-five&quot;) is a license-free, modular, extensible computer instruction set architecture (ISA).  Nov 27, 2024 · M.  PMC Overview An optional TPM 2.  In the event of AC power loss, the power shelves can draw DC power from either the OCP battery backup cabinet or high-density lithium-ion battery packs.  Program; Server.  The Intel&reg; Silicon Photonics 200 Gbps QSFP56 FR4 Optical Transceiver is a small form-factor, high speed, and low power consumption product targeted for use in optical interconnects for data communications applications.  Eric Shobe (Dropbox) Join the Mailing List. 0 Policy Authorization (IBM) - INFO, White Paper, Ownership and Control of Firmware in Open Compute Project Devices, IBM Unlock the power of next-generation data center infrastructure with Sanmina's ORv3 rack, designed to meet the rigorous standards set forth by the Open Compute Project (OCP).  Specification Standards: Electrical Interfaces, Mechanical Interfaces, Manageability, debug, &amp; Test framework.  In addition, it provides some recommendations to the design teams of both the module and the system which is expected to receive the module.  Chiplets have arrived in today&rsquo;s semiconductor economy. 5kW ORv3 power supply features hot-pluggable function for operational safety.  The Security Project creates designs and specifications to enable software security for all IT gear through collaboration with the wider Open Compute community.  It moves common server management, security, and control features from a typical processor motherboard architecture onto a smaller common form factor module.  Disclaimer: Please do not submit any confidential information to the Project Community.  We have been working on redefining an Open Industry Standard Computing Architecture for today's computing needs and it's called the &quot;High Performance Compute Module - Wall of Compute&quot; HPCM-WoC.  The MWOC-RMU can monitor and control the PSUs and/or peripheral equipment installed in the MWOCES-211, MWOCES-192 and MWDCES-191shelves via the PMBusTM and can communicate with host system via Ethernet by SNMP.  OCP Ready.  In order to not cause damages, it is recommended to follow the manufacturers&rsquo; torque OCP Ready. A. 1 Electrical Specification The High-speed PIN electrical specification is based on CEI-56G-VSR-PAM4 in OIF-CEI-4.  MHS envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.  The Modular Data Center Sub-Project collaborates on design and uses of modular solutions optimized for OCP hardware.  Based on OCP v1. 0 x16, Internal Lock bracket. Learn how and why OCP is disrupting the infrastructure industry. E.  Oct 3, 2024 · &ldquo;Whatever good things we build end up building us.  ~D } &micro; o ] ] } v } ] ( ( } &iacute; Download the reference design for this module and the OpenBMC firmware user guide from the OCP Contribution Database Watch a demo of this module running the OpenBMC firmware Read the Implementing Next-Generation Data Center Platform Management Using Intel Agilex&reg; 3 and Intel Agilex 5 Devices solution brief Open Compute Project.  the module is specified by its connector pin-out The module may have one or more form-factors Sub-Project Leadership.  Sustainability 9 3.  Dec 9, 2024 · Open Domain-Specific Architecture (ODSA) Sub-Project Wiki; High Performance Computing (HPC) Sub-Project Wiki; Composable Memory System (CMS) Wiki; Modular Hardware System (MHS) Sub-Project Wiki. 10 CH32V003 microcontroller chips to the pan-European supercomputing initiative, with 64 core 2 GHz workstations in between. ssl.  License 7 1.  This project provides a foundation for securing all IT gear that is designed in other Open Compute projects.  The Open Compute Project Foundation is a 501(c)(6) non-profit incorporated in the state of Delaware, United States.  Bunch of wires, open source, easy-to-port inter-chiplet (die-to-die) interface specification Elad Alon Weekly on Wednesday 9 am PT Call Link: Test Package PoC Open Compute Project. .  Apr 2, 2024 · The Open Compute Project is a rapidly growing community of engineers around the world whose mission is to design and enable the delivery of the most efficient server, storage and data center hardware designs available for scalable computing.  Over the past decade, the Open Compute Project Foundation (OCP) has successfully turned open hardware concepts into reality. Please reach out to the Sub-project lead if you would like to get involved.  This base specification outlines an interoperable, modular hierarchy based on the EXP (Expansion Module) form factor to enable 32*QSFP-DD/OSFP connectors for scale-out.  He served as Project Lead in the Rack &amp; Power Project for 5 years before moving to the OCP Incubation Committee where he now represents the Cooling Environments Project.  The Modular Hardware System (MHS) Sub-Project is under the direction of the OCP Server Project Group.  The Open Compute Project (OCP) centers on a cross- industry initiative to help standardize the server hardware .  The RunBMC daughter board establishes connections with hardware platforms using a 260-pin SODIMM DDR4 connector, specifically designed for insertion into a compatible SODIMM DDR4 socket.  RunBMC is a smarter, simpler, open approach to Out of Band Management for servers.  The Open Rack v3 (ORV3) power shelf provides up to 18 kW of DC power (15 kW N+1) in 1U space.  The primary focus of an OCP Experience Center is to accelerate open innovation and facilitate the widespread adoption of OCP-recognized equipment. 6KW of continuous output power for complete system backup for 5-7 minutes.  Impact 9 2.  It is becoming the de facto open-compute standard for cloud workloads.  The Open Compute Project (OCP) is an organization that facilitates the sharing of data center product designs and industry best practices among companies.  ONIE; SAI; SONiC; Enterprise Connectivity Solutions [Maintenance Mode] Open Network Linux (ONL) [Maintenance Mode] Open Platform Firmware; Rack &amp; Power; Security.  Oct 3, 2024 · Open Compute Project.  The OCP Facility Recognition program is intended to brand your facilities to be OCP Ready.  These meeting are recorded via audio and video. ).  * Disclaimer (2024 August) - The OCP Subproject formerly named Open Domain-Specific Architecture (ODSA) has been renamed to Open Chiplet Economy.  Key features: OCP NIC 3. 0, With Host management, Dual-port SFP28, PCIe 4.  Finally, the Open Rack is also simpler to maintain.  Open Compute Project &bull; Open Rack V3 Monitoring of Power and Battery Systems Date: 15 October 2020 Page 6 1. 2: 0.  Open Compute Project. 0 Small Form Factor adapter; Intel&reg; Ethernet Controller X710-AT2 Open Compute Project Yosemite V3. 0a and 2. 2 Acknowledgements 8 2. 2 Accelerator Module Hardware Specification 0.  As a global market leader in electronic system enclosures, Sanmina brings unparalleled expertise and innovation to every step of the process, from initial concept to The Open Compute Project adds a new dimension to the OCP Marketplace with the introduction of the Open Chiplet Economy. 0, with host management, 25GbE Dual-port SFP28, PCIe3.  This recognition marks a significant milestone for the leading technology Cliff Grossner- Ph. io Hardware Management Module channel; Active Documents Sep 4, 2024 · At the Open Compute Project Foundation, Dr.  Today, the company's infrastructure supports more than 3.  In 2009, Meta started a journey in designing efficient and sustainable data centers that ultimately led to the founding of the Open Compute Project (OCP).  The Switch Abstration Interface (SAI) Sub-Project is under the direction of the OCP Networking Project Group. 5kW Open Rack Version 3 (ORv3) Power Supply Delta&rsquo;s 5.  The Open Compute Project was first initiated by EIA 310-D/E 19&rdquo; Rack Derivative Chassis and Sleds using Open Rack Motherboards Components and Peripherals-riser cards, mezzanine I/O, accelerators, networking.  The module may have one or more form-factors. ) Photowave&trade; is the first optical communications hardware designed for PCIe and Compute Express Link (CXL) connectivity. 7 %&micro;&micro;&micro;&micro; 1 0 obj &gt;/Metadata 4681 0 R/ViewerPreferences 4682 0 R&gt;&gt; endobj 2 0 obj &gt; endobj 3 0 obj &gt; endobj 4 0 obj &gt;/ExtGState &gt;/XObject &gt;/ProcSet[/PDF/Text by cold plate module vendors. 3V VIO_CFG_GN D Oct 17, 2023 · Launches New Community Led Security Program Improving IT Device Security Posture.  Contributions to this Specification are made under the terms and conditions set forth in Open Compute Project Contribution License Agreement (&ldquo;OCP CLA&rdquo;) (&ldquo;Contribution License&rdquo;) by: Facebook Inc Open Compute Project. 5kW with 5+1 redundancy, a design to ensure the stable operation of servers. 5 and Crater Lake server specification describes a design which can be used to Open Compute Project.  OCP has multiple committees, including the board of directors, advisory board and steering committee to govern its operations.  Modern data centers are composed of a wide variety of processing devices (CPU, GPU, FPGA, etc.  Feb 25, 2021 · An example is the OCP openEDGE BBU module which offers 1.  The Open Compute Project (OCP) Global Summit 2024 is fast approaching and we have been building an amazing program.  License Contributions to this Specification are made under the terms and conditions set forth in Open The Open Accelerator Infrastructure (OAI) Sub-Project is under the direction of the OCP Server Project Group.  Overview 12 6.  Date: 01/09/20 Page 3 1.  Compliance with OCP Tenets 9 2.  Google LLC Sep 18, 2024 · Open Compute Project.  ConnectX-6 Dx EN adapter card, 25GbE OCP3.  Scope 11 5.  Guidelines were created by our Data Center Facility Project Team and serve as a reference for data center operators and tenants who want to understand the fundamental facility requirements to deploy this gear into their IT space. cf1. 0 Feb-15 Facebook Open Rack V2 DC PDU Specification: 1.  [1] See full list on 146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.  When an L10 system integrator receives the module, visual inspection is suggested to screen out and any visible damage on the module, before being assembled into the chassis.  the module is specified by its connector pin-out; The module may have one or more form-factors .  The Modular Hardware System (MHS) Subproject envisions interoperability between key elements of data center, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.  Scale 9 2. 3V PLA_S3# O Reserved for Power loss Assert. 5kW power supplies with a maximum power of 33 kW, or 27.  3.  The DS5000 Baseboard provides connectivity for the COM-E Module, BMC Module, Switch Board, PSU Board(s), and Fan modules.  This presentation will showcase how optical compute interconnects are revolutionizing open data center architectures, offering unprecedented bandwidth and energy efficiency. 2 12/13/19 Facebook OCPHL-P Presented in 1/2/20 WG call Specification Dual M. 0 Feb-15 Facebook Facebook Open Rack V2 Power Shelf Specification: 1. 0 JUL-15 Facebook Open Rack V2 EU 230V AC PDU Specification: 1. 0 module design provides hardware security to prevent unwanted users from accessing your data.  Integrated Solutions - Highlights cloud and enterprise-level hardware configurations and software stacks to address particular workloads built on OCP recognized products such as IaaS, PaaS, SaaS, Private Cloud, AI, Immersion and Heat Reuse.  It connects to the busbar through a convenient blind-mate power connection, it connect with a dedicated ORV3 power cord, including IEC and NEMA configuration.  Sep 26, 2019 · Hardware Management Module; Hardware Fault Management; Cloud Service Model Workstream; OpenRMC-DM; Networking.  Open Rack V3 PMI ORV3 Power Monitoring Interface (PMI) Module Typical Application Open Compute Project Input Connector Edge Connector Output Connector 4 x RJ45 Connector Communication Protocol MODBUS Advanced Energy's Artesyn PMI is an extension module, AT A GLANCE which brings MODBUS of the PSU/BBUs directly out for upstream communication.  This module contains all the FW states previously housed on a typical processor motherboard.  Open Compute V2 Server Open Compute V2 Drive Tray, 2nd lower tray extended. 7 billion users and incorporates the hardware innovations and solutions driven and open sourced through the Open Compute community.  Learn more about the 2025 OCP EMEA Summit.  The Open Compute Project (OCP) Foundation is seeking a highly motivated full-time employee to assist with its vibrant and growing Community.  The Open Compute Project (OCP) Foundation is seeking a highly motivated full-time employee to assist with the management and expansion of channel programs. 2 Accelerator Module Hardware Specification 12 March 13, 2019 PLN# I Reserved for Power Loss notification. 1 Date: 09/13/2021 Page 10 8. 1 Openness The Project Tahoe Data Center Secure Control Module (DC-SCM) is an open-source design that adheres to the DC-SCM 2.  These solutions have proven to be cost effective and efficient at heat extraction.  11 Figure 2 OAI building blocks 12 Figure 3 Example OAI System Building Blocks 13 Figure 4 Example UBB System Building Blocks 14 Figure 5 Universal Reference Base Board (UBB) 15 Figure 6 UBB Host and Expansion (scale-out) Interfaces 16 Figure 7 Input Power connectors Placement 18 Cliff Grossner- Ph.  Openness 9 2. 5% peak efficiency, reducing unnecessary power losses.  Feb 23, 2022 · The OAM design specification defines the form factor, standard specifications for a compute accelerator module, and a compliant baseboard design enabling interoperability across multiple ASIC or GPU-based mezzanine modules and baseboard design interfaces.  In this specification, the fluid connector is identified as the Universal Quick Disconnect (UQD), which is designed with interface dimensions to ensure compatibility universally on both plug and socket.  This role will play a key part in supporting OCP&rsquo;s global community of members, including manufacturers, systems integrators, component manufacturers, ODMs, and data center operators.  Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announced a new program, OCP Security Appraisal Framework and Enablement (S.  PMI sits on Open Rack V3 Power and Battery Shelves. rackcdn.  October 15th, 2024.  NC in module.  Aug 27, 2024 · AUSTIN, TX &ndash; August 27, 2024 &ndash; The Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, is proud to announce Aligned Data Centers as the first data center provider to earn OCP Ready&trade; for Hyperscale certification.  Datacenter applications are the primary target of time appliances project. 0, Version 1. 0 Feb-15 Facebook Fidelity Open Bridge Specifikace n&aacute;vrhu modulu akceler&aacute;toru OCP popisuje mechanick&eacute;, tepeln&eacute;, elektrick&eacute; a dal&scaron;&iacute; požadavky pro vložen&iacute; akceler&aacute;torov&yacute;ch karet do serveru nebo přep&iacute;nače.  Danfoss Hansen&reg; Universal Quick Disconnect Blind-Mate (UQDB) has been designed with OCP (Open Compute Project) Community to set industry standard for thermal management application in data centers.  Successful projects delivered by this project will: Portwell OCP NIC 3.  License 1. 0 Network Module with 2x 10GbE copper ports &amp; bypass function.  Open Accelerator Infrastructure Host Interface Clocks and SideBand signalsd RACK POWER Figure 1 OAI as a disaggregated compute for AI in a Rack.  A comprehensive set of OCP offerings from our certified OCP Solution Providers.  Open Compute Project &ldquo;Rack &amp; Power&rdquo;.  Call Calendar.  Scope Oct 3, 2024 · Christian Urricariet from Intel will explore the integration of co-packaged optics within AI and compute infrastructures.  Open Compute Project Collaboration Opens Doors to New Data Center Modular Hardware Systems.  Feb 28, 2023 · Defines all the requirements for an M-CRPS internal redundant power supply used in Open Compute Project that could be used in different environments like home/office, datacenter, and high-performance computing, hence harmonizing the server power supply requirements used in the industry with the purpose of creating a standard specification that The Open Compute Project adds a new dimension to the OCP Marketplace with the introduction of the Open Chiplet Economy.  Each fan module incorporates a small fan board to connect the fan and associated circuitry to the fan module board.  Compliance with OCP Tenets 2.  The deliverable includes reference design files and associated software required to rec-reate the (PMI) Module used in the Open Compute Projec t.  We receive great questions about the OCP Solution Provider program, OCP Marketplace and the various channel related initiatives.  MWOC-RMU is a Remote Management Unit (RMU) for MWOCS series, OCP compliant power shelves.  These regional meetings will occur in correlation to local Chinese time zones, in the Mandarin language and will modify requirements as suitable.  Delta&rsquo;s 33kW 1OU ORv3 power shelves are 6-slot chassis solutions that accommodate six 5.  The Open Chiplet Economy Sub-Project is under the direction of the OCP Server Project Group.  This electronic board is designed May 31, 2022 · The Open Compute Project (OCP) The OCP Accelerator Module (OAM) design specification, first announced in March 2019 Global OCP Summit, defines the common Open Compute Project - 200G FR4 OCP Optical Transceiver Specification Rev0.  ConnectX&reg;-5 Ethernet network interface card for OCP 3.  The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software. 0 LVDS Tunneling Protocol &amp; Interface Specification (LTPI) Revision 1.  OPTION B: Open Web Foundation (OWF) CLA 7 1.  The advantages that OCP hardware provides in maintainability and scalability is magnified in the modular environment. ) and peripheral components (network controllers, accelerators, storage devices, etc. 0 x16, Crypto and Secure Boot, Thumbscrew (Pull Tab) Bracket Sep 18, 2024 · Open Compute Project.  to produce solutions compatible with existing/traditional operation The OCP's Cold Plate Sub-Project is a key piece within the Cooling Environments Project.  Originally designed for computer architecture research at Berkeley, RISC-V is now used in everything from $0.  The specifications list key requirements and constraints that the design must meet but leaves room for innovation for The Open Accelerator Infrastructure (OAI) Sub-Project is under the direction of the OCP Server Project Group. Overview This power module allows blind mate connection of a server to busbars.  Available in multiple form factors, Photowave leverages the significant latency and energy efficiency of photonic technology, empowering data center managers to scale resources within or across server racks.  OCP Accelerator Module Spec &bull; Support both 12V and 48V as input &bull; Up to 350w(12V) and up to 700w(48V) TDP &bull; 102mm x 165mm &bull; Support single or multiple ASIC(s) per Module &bull; Up to eight x16 Links (Host + inter-module Links) &bull; Support one or two x16 High speed link(s) to Host &bull; Up to seven x16 high speed interconnect links This document defines the technical specifications for the &ldquo;Power Connection &amp; Power Distribution Module&rdquo; used in Open Compute Project servers. com Welcome to the OCP High Performance Computing (HPC) Sub-Project.  May 17, 2023 · The review will cover on-going work in HW fault mgmt, HW mgmt modules (DC-SCM, RunBMC), HW mgmt for liquid cooling and a survey of open-source Redfish software agents. 0 Feb-15 Facebook Open Rack V2 Battery Backup Module 3600W Specification: 2.  The key to further increasing the impact of OCP is to lower barriers for OCP server evaluation and reduce time-to-market for OCP server adoption, enabled through Open System Firmware (OSF) innovations.  (Chief Innovation Officer) - Open Compute Project Foundation (OCP) Bijan Nowroozi (CTO) - Open Compute Project Foundation (OCP) Video: Slides: Open Systems for Density and AI: David Schmidt (Senior Director- Server Product Management) - Dell Technologies: Video: Slides: Optimizing High-Density Storage for AI and Ml Sep 4, 2024 · Quantum technology is on a development path that will impact the computational and communications markets in the coming years.  There are two symmetrical PDU installed on the rear frame side of the OCP Open Rack.  Fully disaggregated and open networking HW &amp; SW; Operating System - Linux based operating systems &amp; developer tools, and ReST API&rsquo;s Nov 18, 2020 · Open Compute Project.  May 15, 2023 · Open Compute Project &bull; Project Argus Date: May 15, 2023 Page 2 Table of Contents 1.  Kasper Wszolek (Intel Corporation) Tim Lambert (Dell) Join the Mailing List In 2019, the Foundation initiated the OCP Future Technologies Symposium, a bi-annual event that features a call for posters, and brings together academia, the technology industry, startups, venture capital and analyst firms to solve future challenges facing the industry, and accelerate productization through partnerships and open source R&amp;D.  High Speed Signals 8. ) Program.  Just as a strategy of modularization has impacted data center hardware at large, from design and operations, so too is this trend coming to the foundations of computing.  PMI Overview PMI is an extension module, which brings MODBUS of the PSU/BBUs directly out for upstream communication.  The language used in this document is meant to prescribe a RunBMC module that will conform to this specification.  The Projects are really where the action is within the OCP Community! With dozens of active Projects and Sub-Projects, this is where the majority of the collaboration occurs in OCP.  Mar 19, 2019 · OCP Accelerator Module (OAM) specification defines an open-hardware compute accelerator module form factor and its interconnects.  OCP Technology and Vertical Projects are discussed as applicable across this region. 4 Authors: DavidSun,PowerEngineer,Meta DmitriyShapiro,MechanicalEngineer,Meta BenKim,ComplianceEngineer,Meta JayatiAthavale,ThermalEngineer,Meta The HPC project has been established in the Open Compute Project to service the needs of the High Performance Computing, Supercomputing and High Performance Data Analytics of the computing industry and to service it with open hardware platforms delivering solutions in the market from system level down to silicon.  Workstream Leadership.  Though not a standards body, the OCP Community forges new technology norms, fostering an ecosystem where industry players collaborate in a safe framework, shaping a versatile and diverse supply chain.  Teledyne LeCroy is a leading provider of test, validation, and benchmarking test platforms to the storage industry.  The 2024 OCP Global Summit theme is &quot;From Ideas to Impact&quot;.  The primary goal of the sub-project is to drive standardization and enable an open ecosystem for direct liquid cooling applications within the industry.  Project Olympus base specification defines a modular architecture with clear internal and external interfaces.  The management controller module separates the common platform management hardware and places them behind a connector.  Scope.  Following this contribution, the Open Compute Project Foundation is chartering an Open Accelerator Infrastructure (OAI) sub-project within OCP Oct 10, 2024 · This Project is open to the public and we welcome all those who would like to be involved.  - Trusted Platform Module 2.  Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announced an expansion of its Open Systems for AI Strategic Initiative, with approved contributions from NVIDIA, including the NVIDIA MGX OCP Ready.  The power supplies features up to 97. 3.  Overview 2CRSI has developed a new power distribution unit for the Open Compute Project with the implementation of a current monitoring solution.  Since then, he has been a champion of OCP.  Version Table 10 4.  Oct 6, 2024 · Open Rack V2 277V AC PDU Specification: 1.  Let&rsquo;s look at one track specifically. 0&rdquo;) (&ldquo;Contribution License&rdquo;) by: Dell, Inc.  The leading use cases for adoption include quantum-safe encryption algorithms, secure quantum key distribution, accelerated compute for AI and life sciences, and quantum-based random number generation.  to produce solutions compatible with existing/traditional operation Control Module (DC-SCM) with a standardized Datacenter-ready Secure Control Interface (DC-SCI).  Nov 4, 2024 · - Hardware Mgmt Module Subproject: Kasper Wszolek (Intel), Eric Schobe (Dropbox).  So we put together these FAQs where you'll find answers to common queries about program benefits, marketplace requirements, product recognition (OCP Accepted&trade;, OCP Inspired&trade;), OCP Ready&trade;, OCP Experience Centers and OCP S.  Nov 9, 2021 · We shared the Prineville data center designs with the public and, along with Andy Bechtolsheim, Goldman Sachs, Intel, and Rackspace, launched the Open Compute Project (OCP) and invited other members to collaborate and build on our progress.  It's free and open to anyone.  programs.  Sep 20, 2024 · Open Accelerator Infrastructure (OAI) OCP Accelerator Module (OAI-OAM) OAI Universal Baseboard (OAI-UBB) OAI Host Interface (OAI-HIB) OAI Power Distribution (OAI-PDB) OAI Expansion Beyond UBB (OAI-EXP) OAI Security, Control, and Management (OAI-SCM) OAI-Tray OAI Chassis (This chapter will address air-cooled and liquid-cooled aspects as well.  It's tool free, so servicing is faster and easier.  The Innovation Village at the 2024 OCP Global Summit offers an engaging platform for attendees to explore the latest innovations of the Open Compute Project Community, and experience emerging technology that is likely to end up in tomorrow's products showcased by startups, academics and researchers. 1 Open Web Foundation (OWF) CLA Contributions to this Specification are made under the terms and conditions set forth in Open Web Foundation Modified Contributor License Agreement (&ldquo;OWF CLA 1.  The Open Accelerator Infrastructure will be composed of these base building blocks: &bull; OAI Power Distribution (OAI-PDB): The translation between Rack Power to UBB module power needs. 1. 0 section 16, table 16-2 and table 16-4.  Jun 23, 2020 · Since inception, Project Olympus has attracted a large group of partners such as compute silicon providers, ODMs, OEMs, and component manufacturers. 5 Platform Design Specification 6 November 29, 2023 3 Compliance with OCP Tenets 3. F.  As the need for bandwidth continues to increase, Facebook is deploying the next generation of optics which expands capacity and offers a seamless transition from 100G CWDM4 optics currently used in our large-scale data centers.  Module vendors need to comply to the module input and Steering Commitee Representative is Steve Mills; High performance computing has used liquid cooling for many years.  On the other end, interacts The activities for this area are in the purview of the Open RMC subproject; Management Controller Module.  This encapsulates the transformative journey at the heart of the Open Compute Project.  Aug 11, 2019 · This document is a technical specification for the RunBMC used in Open Compute Project.  (Chief Innovation Officer) - Open Compute Project Foundation (OCP) Bijan Nowroozi (CTO) - Open Compute Project Foundation (OCP) Video: Slides: Open Systems for Density and AI: David Schmidt (Senior Director- Server Product Management) - Dell Technologies: Video: Slides: Optimizing High-Density Storage for AI and Ml Oct 3, 2024 · Christian Urricariet from Intel will explore the integration of co-packaged optics within AI and compute infrastructures. ) designed to improve the trustworthiness of devices across all data center IT infrastructure.  Oct 15, 2024 · NVIDIA and Meta Contribute Modular Server and Rack Technologies Establishing New Multi-Vendor AI Cluster Supply Chain .  The project also aims at openness and interoperability through the use of open-source PTP software implementations for timing appliances.  Oct 15, 2023 · Open Compute Project &bull; Project Tahoe DC-SCM Board Specification Page 4 2.  OpenRackV348VBBU Rev:1.  AI is Open Compute Project's Biggest Challenge: Zaid Kahn, Board Chair of Open Compute Project (OCP), recognizes the challenges posed by the rapid development of AI, necessitating a rethink in system design, data center construction, and infrastructure cooling.  2.  We will also provide overviews of recently announced workstreams for RAS API, fleet memory fault mgmt, GPU mgmt, server component resiliency, and the cloud service model.  DC-MHS for data center applications; Edge-MHS for Edge applications; SCM Secure Control Module; Workstreams and Special Projects Jun 16, 2020 · Open Compute Project.  The OCP Security Appraisal Framework and Enablement (S. 0 1.  They are no longer an idea or a conceptual design, but are used in a variety of high value products, such as CPUs, and GPUs for datacenter and AI applications or for Oct 8, 2024 · The management controller module separates the common platform management hardware and places them behind a connector.  Facebook, Microsoft and Baidu contributed the OAM design specification to the OCP community during 2019 OCP Global Summit.  (NASDAQ: BIDU) announced a new collaboration with Facebook and Microsoft to define the OCP Accelerator Module (OAM) specification to increase the adoption of artificial intelligence (AI) accelerators to benefit the development of AI.  Sep 2, 2024 · The Open Compute Project (OCP) Foundation would like to thank everyone who voted and all the candidates who participated in the 2024 Project Lead (PL) Elections. 2 12/13/19 Facebook OCPHL-P Presented in 1/2/20 WG call Product QCT Rackgo X MiniLake for OCP R1 QCT Rackgo X MiniLake_Design_Package_1023 Nov 10, 2023 · Join the Open Chiplet Economy session at the Chiplet Summit in February.  Enterprises adopting more complex and .  The Open Compute Project adds a new dimension to the OCP Marketplace with the introduction of the Open Chiplet Economy.  The Open Compute Project was first initiated by Facebook, now Meta, in 2011.  Sep 19, 2023 · configuration, programming, management, debug, inter-module communication to scale-up, and input/output bandwidth to scale out.  The module is specified by its connector pin-out called DC-SCI.  Jan 14, 2025 · The DC-SCM module specification separates the common platform management and security hardware and places them behind a connector.  Fan Module Board The DS5000 supports three field replaceable fan modules as shown below.  The scope of this OAI subgroup is to define below 9 schedules for physical modules include logical aspects such as electrical, mechanical, thermal, management, hardware security, physical serviceability, etc. 0 Revision 1.  The power module consists in an electronic board with connectors soldered on it.  This role will be critical in supporting OCP&rsquo;s global Community of members, including data center operators, manufacturers, systems integrators, component manufacturers, and ODMs.  DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms. 2.  Mar 14, 2019 · Today at the Open Compute Project (OCP) 2019 Global Summit, Baidu Inc.  They are no longer an idea or a conceptual design, but are used in a variety of high value products, such as CPUs, and GPUs for datacenter and AI applications or for Open Compute Project - 400G FR4 OCP Optical Transceiver Specification Rev0.  High Performance Computing; NIC; Open Oct 9, 2024 · 25G/100G platform that AT&amp;T is submitting to the Open Compute Project.  D.  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